ASIA unversity:Item 310904400/17507
English  |  正體中文  |  简体中文  |  全文笔数/总笔数 : 90120/105277 (86%)
造访人次 : 8144017      在线人数 : 1819
RC Version 6.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
搜寻范围 查询小技巧:
  • 您可在西文检索词汇前后加上"双引号",以获取较精准的检索结果
  • 若欲以作者姓名搜寻,建议至进阶搜寻限定作者字段,可获得较完整数据
  • 进阶搜寻


    jsp.display-item.identifier=請使用永久網址來引用或連結此文件: http://asiair.asia.edu.tw/ir/handle/310904400/17507


    题名: Weaving technology and mechanical properties of extended-PTFE fabrics
    作者: 林敬文;Lin, Ching-wen
    贡献者: 時尚設計學系
    关键词: Electromagnetic shielding effectiveness (EMSE);Co-woven-knitted fabric (CWKF);Conductive textiles;Coaxial transmission line
    日期: 2007-10
    上传时间: 2012-11-26 10:33:45 (UTC+8)
    摘要: "During the fabricating of extended-PTFE (ePTFE) fabrics, we found that the ePTFE yarn is easy to be collapsed because of excluding each other by electrostatic friction of the ePTFE yarn during warping procedure. Therefore, the single warping was adopted in the experiment and we also added some anti-electrostatic solution and enhanced the humidity of warping to decrease the influence. During weaving process, the small fell of cloth (32 mm) was carried out and the warp level angle (312°) was advanced to prevent the crinkle of fabric caused by shrunk weft yarn.

    In the investigation of the physical properties of ePTFE fabric, we found that both of the acid-resistance and heat-resistance are really excellent. Even if the ePTFE fabric is used in the environment temperature of 300 °C for 1 h, there is still no change in the mechanical properties. Heat shrinkage has rarely different at temperature of 100 and 200 °C, but it changed obviously at the temperature of 300 °C. In this study, when the fabric structure was 3/1 right twill and the weft density was 20 picks/cm, it will have the optimum breaking strength."
    關聯: JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
    显示于类别:[時尚設計學系] 期刊論文

    文件中的档案:

    档案 描述 大小格式浏览次数
    index.html0KbHTML79检视/开启


    在ASIAIR中所有的数据项都受到原著作权保护.


    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - 回馈