"Technological advancement in IC- manufacturing
continues to increase in demand of about 8-10% per year. Due to
continued and rapid growing market for IC industry, extension
of semiconductor manufacturing sites wafer fabrication (fab) is
necessary. Large-scale firms have to transfer the manufacturing
technology from one country to another in order to save cost.
One of key issues for the firms is to make sure the most efficient
and practical way for technology transfer. The objective of this
research is to propose a systematical analysis methodology for
international intra-firm technology transfer in the IC-industry.
This paper utilizes an international case study on a recent
technology transfer in the IC industry. A set of key performance
index (KPIs) are defined to measure the grade of success of the
project management. This study uses KPIs evaluation of the
technology transfer project setup success key factors (SKFs) and
process. We combine the literature review, interview expert and
project management to construct individual KPIs of technology
transfer project. Technology transfer is closely related to
knowledge transfer. It’s a time limited transaction and is treated
as a project. A structured and organized procedure with
dedicated teams at the sending and receiving site is necessary.
The “copy smart” methodology is applied in this case study. The
findings of this study suggest further improvements for
technology transfer projects can be made by locating the project
leader at the receiving site in order to have better control."
PICMET: Portland International Center for Management of Engineering and Technology, Proceedings