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    ASIA unversity > 資訊學院 > 資訊工程學系 > 期刊論文 >  Item 310904400/25369

    Please use this identifier to cite or link to this item: http://asiair.asia.edu.tw/ir/handle/310904400/25369

    Title: Characteristics of thin-film transistors based on silicon nitride passivation by excimer laser direct
    Authors: 陳兆南;Chen, Chao-Nan;黃俊杰;Huang, Jung-Jie
    Contributors: 資訊工程學系
    Keywords: Amorphous-silicon (a-Si);Laser direct patterning;Silicon nitride (SiNx);Thin-film transistor (TFT)
    Date: 2013-02
    Issue Date: 2013-07-11 14:19:08 (UTC+8)
    Abstract: This study explored the removal of silicon nitride using KrF laser ablation technology with a high threshold fluence of 990 mJ/cm2. This technology was used for contact hole patterning to fabricate SiNx-passivation-based amorphous-silicon thin films in a transistor device. Compared to the photolithography process, laser direct patterning using KrF laser ablation technology can reduce the number of process steps by at least three. Experimental results showed that the mobility and threshold voltages of thin film transistors patterned using the laser process were 0.16 cm2/V-sec and 0.2 V, respectively. The device performance and the test results of gate voltage stress reliability demonstrated that laser direct patterning is a promising alternative to photolithography in the panel manufacturing of thin-film transistors for liquid crystal displays.
    Relation: Thin Solid Films, V.529 : 449–453.
    Appears in Collections:[資訊工程學系] 期刊論文

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