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    Please use this identifier to cite or link to this item: http://asiair.asia.edu.tw/ir/handle/310904400/78484


    Title: 積體電路封膠之膠體表面自動瑕疵檢測系統
    Authors: 陳思翰;彭德保;Perng, Der-Baau
    Contributors: 資訊多媒體應用學系
    Date: 2013.10
    Issue Date: 2013-12-26 18:15:05 (UTC+8)
    Abstract: 晶圓(Wafer)封裝製程(Packaging)使得訊號可透過封裝材料連接至系統,且能避免矽晶片受外力與濕氣之破壞,因此封膠品質掌握了產品的成敗因素,然而,囿於製程的不穩定,封膠(Molding)過程中,膠體表面會產生不同類型的瑕疵,如表面刮痕(Crack)、破損(Dilapidation)與氣洞(Void)等,人工檢測時,破損瑕疵較為明顯不易漏抓,但太細的刮痕瑕疵以及對比不明顯的氣洞則易被忽略;因此,發展一套自動化的膠體瑕疵檢測系統實有其必要性。本研究所發展之系統,以電荷耦合元件(Charge
    Coupled Device)、同軸光(Coaxial Light)與背光(Back Light)組成取像光學模組,藉著膠體表面呈現統計性紋理(Statistical Texture)之特性,運用離散傅立葉轉換(Discrete Fourier Transformation)法將紋理映射成頻譜上的高頻成分,並以濾波器加以壓抑;在還原影像上,因紋理的灰度值被限制在一定的範圍內,而瑕疵與正常圖樣則反之,故配合二值化法與二值大型元件(Binary Large Object)之特徵萃取來突顯出膠體上的瑕疵。
    Relation: 第13屆全國AOI論壇與展覽
    Appears in Collections:[Department of Applied Informatics and Multimedia] Proceedings

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