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    Please use this identifier to cite or link to this item: http://asiair.asia.edu.tw/ir/handle/310904400/89587


    Title: A Novel Tape and Diamond Process Developed for Polishing Hard Substrates
    Authors: 葉榮輝;YEH, RONG-HWEI;Tsung-Ming, C;Chao, Tsung-Ming;C.K.Lee;C.K.Lee;A.H.Tan;A.H.Tan
    Contributors: 光電與通訊學系
    Date: 2015-05
    Issue Date: 2015-09-03 14:42:34 (UTC+8)
    Relation: Key Engineering Materials
    Appears in Collections:[光電與通訊學系] 博碩士論文

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