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    ASIA unversity > 資訊學院 > 光電與通訊學系 > 期刊論文 >  Item 310904400/96321

    Please use this identifier to cite or link to this item: http://asiair.asia.edu.tw/ir/handle/310904400/96321

    Title: Study of Electroplated Nickel Layer Thickness and Saw Parameters on Cutting Performance in Diamond Wire Sawing of Sapphire Ingots
    Authors: 葉榮輝;YEH, RONG-HWEI;H. Y. Chen;H. Y.Chen;C. K. Lee;C. K.Lee;A. H. Tan;A. H.Tan
    Contributors: 光電與通訊學系
    Date: 2015-05
    Issue Date: 2015-12-11 14:13:35 (UTC+8)
    Abstract: A production-scale multiwire saw machine and 4 inch sapphire ingots were used in this
    study. The diamond wire used in the study had a core diameter of 0.1mm with an attached diamond
    particle size of 8–12µm. This study uses the Taguchi method and Grey relational analysis on the key
    diamond wire parameters which are electroplated nickel layer thickness, diamond wire tension,
    diamond wire speed and sapphire ingot feed rate, in order to simultaneously optimize the cutting
    performance in the diamond wire sawing of sapphire ingots. Based on the analysis, the nickel layer
    thickness and wire speed are the first and second most significant factors with 31.7 and 29.9% effects
    on cutting performances. The optimal control factors were then simultaneously evaluated for Ra,
    material removal rate, diamond wire wear rate and TTV and were found at optimization to be 14 µm
    nickel layer thickness, 15NT wire tension, 800m/min wire speed and 0.2mm/min feed rate,
    respectively. Compared with current standard condition, this improved process obtained from the
    optimization of diamond wire electroplated nickel layer thickness and saw machine parameters in the
    diamond wire sawing of sapphire ingots can achieve a 33% lower Ra, a 20% lower diamond wear rate,
    a 13% lower TTV and a 20% higher material removal rate, simultaneously.
    Relation: Key Engineering Materials
    Appears in Collections:[光電與通訊學系] 期刊論文

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